I just went down a path of discovery trying to fully understand the differences between Bonding and NIC Teaming.
Bonding, of course, has a concept of "bonding modes" that allow you to use NICs together for a failover purpose in active-standby mode, and even active-active failover. When using these modes, however, the focus is not gluing the NICs together to achieve linear increases in bandwidth (i.e. 10G + 10G = 20G). To get into true link aggregation, you need to use different bonding modes that are specifically for that purpose. I will include a link that discusses in detail the bonding modes in Linux:
So what is the difference, between using Bonding Mode 4 (LACP Link Aggregation), or Bonding Mode 6 (Adaptive Load Balancing), and NIC Teaming?
I found a great link that covers the performance differences between the two.
https://www.redhat.com/en/blog/if-you-bonding-you-will-love-teaming
At the end of the day, it comes down to the drivers and how well they're written of course. But for Red Hat 7 at least, we can see the following.
The performance is essentially "six of one half dozen of another" on RHEL 7, on a smaller machine with a 10G Fiber interface. But if you look carefully, while NIC Teaming provides you gains on smaller packet sizes, as packet sizes start to get large (64KB or higher), the Bonding starts to give you some gains.
I'll include the link and the screen snapshot. Keep in mind, I did not run this benchmark myself here. I am citing an external source for this information, found at the link below:
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